Emerson’s latest IIoT solutions will be in full display at the PACK EXPO Las Vegas exhibit where attendees can engage with experts, experience new technologies and attend educational sessions. High resolution image
Attendees can visit Emerson’s booth at #SL-6307 to engage with subject matter experts and find targeted solutions for their businesses.
LAS VEGAS, (Sept. 27, 2021) – Emerson will feature a portfolio of new and updated packaging technologies and solutions at PACK EXPO 2021, which will be held from September 27-29 at the Las Vegas Convention Center. The conference organizers estimate more than 15,000 attendees will take in live demos, exhibits and educational sessions.
This year’s PACK EXPO is sponsored in part by Emerson and offers the largest variety of packaging and processing industry leaders, technical experts, customers, and suppliers with more than 70 sessions on packaging innovations, best practices, e-commerce, safety, and sustainability.
Attendees can visit Emerson’s booth at #SL-6307 and engage with subject matter experts to find targeted solutions including ways to achieve sustainability goals. Emerson’s IIoT-enabled pneumatic sensors help detect leaks and optimize air consumption in real-time to lower energy costs, reduce CO2 footprint, and improve overall energy efficiency and sustainability of facilities.
The booth showcases advanced hardware and software packaging solutions including:
• Augmented reality - provides immediate, real-time access to machine settings and performance
• Plant utilities and energy monitoring - continuous monitoring of compressed air flow in real time to identify leaks, optimize pneumatic processes and improve air flow efficiency.
• Ultrasonic sealing - enhanced process control and data feedback to support sustainability needs
• Plant SCADA & analytics - build smarter machines with Movicon.NExT™ software technology to get instant analytics
• Leak detection - ensure seal integrity using laser detection technology
• Industrial automation controls - accelerate digital transformation with solutions that offer openness and scalability
• Clean-in-place - increase efficiency and improve safety by reducing cross-contamination
• Fluid control and pneumatics – meet production and sustainability targets with IIoT fluid control and pneumatics solutions
On, Sept. 27 at 2 p.m., Emerson will present its Innovation Stage presentation “Depalletizer Machine Condition Monitoring via IIoT Solutions to Maximize OEE” to showcase how Emerson and Busse/SJI partnered to develop and digitally transform a high-level bulk depalletizer that provides real-time, actionable data to increase overall equipment efficiency. The new, customizable, edge-based system increases uptime and is scalable to adapt to any primary product palletizing system or complete packaging line.
Emerson also sponsors the Amazing Packaging Race and the Packaging and Processing in Women’s Leadership Networking and Breakfast. On Sept. 28, the networking breakfast will feature a panel of experts discussing different perspectives on how to thrive in the current market. On Sept 29, engineering college students will compete in the Amazing Packaging Race where they will will team together and race to exhibitor booths to perform hands-on challenges and win prizes.
