Thermal Processing
Solutions for your alternative joining needs. Designed for staking, insertion, swaging, degating and stamping.
Emerson thermal processing is an alternative to welding. It is ideal when the joined parts are dissimilar materials that cannot be welded or when simple mechanical retention of one part relative to another is not adequate. Our assembly technologies are based on decades of development and are globally supported to deliver a custom-tooled solution that meets your joining needs. Multiple sizes and material options can be driven simultaneously, making quantity, size and insert plane virtually unlimited.
The thermal joining process is a flexible alternative joining method for sensitive electronics, circuit boards, instrument housing and other applications that require the assembly of dissimilar materials. It is a delicate process that joins materials in a way that will not damage sensitive componenents. On plastics, the controlled flow of the melted plastic is used to capture or retain another component. For non-plastic materials, thermal heat is used to create impressions (stamping) or embed materials.
Staking provides a mechanical lock of dissimilar materials with consistent results. This process is primarily used in low-volume and development processes. Staking eliminates consumables and results in minimal stress in formed plastic. Using Branson technology multiple planes can be staked simultaneously. Branson thermal processing supports a design profiles including standard profile, low profile, dome, knurled, flush, hollow, and high-pressure.
In swaging, the horn rolls over a wall section of material to provide structural retention. Swaging is used in a variety of applications including electronic components, medical valves and automotive filters. Swaging provides simple and reliable construction and support combining a variety of shapes.
Thermal degating is used to separate a part from the gate on a plastic molded component. Using a standing wave to oscillate the part, Branson thermal processing equipment can remove the gate material on all sides of a component at once. Components should use a localized gate area to facilitate the gate removal.
Designed for heat staking, thermal insertion, swaging, degating and date stamping. Key benefits include excellent cosmetics, minimal tool wear and flash and particulate free end results.